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  • ITO target with copper backing plate metallic bonding

ITO target with copper backing plate metallic bonding

  • For optical coating, vacuum coating, sputtering target material, magnetic film, electronic material, alloy material, etc.
  • INQUIRY

Item

Standard

Components 

In2O3:SnO2=90:10(wt%), or to customer requirements

Purity

4N

Relative density

≥99.3% (theoretical:7.15g/cm3)

Resistivity

≤1.8Ω·mm2/m

Oxygen bleeding rate

≤0.5%

Appearance 

Flakes or other shapes

color is uniform; smooth surface, without cracks, edges and corners, and without any foreign inclusions and pollutants

Internal 

no crack or foreign matter inside













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