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Name | Phenoxycycloposphazene |
Molecular Formula | C36H30N3O6P3 |
Molecular Weight | 693.56 |
CAS Registry Number | 1184-10-7 |
EINECS Number | 208-127-2 |
Density | 1.31 |
Melting point | 116 ºC |
Appearance | White to yellowish crystalline powder or particles |
Conductivity(μS/cm) | ≤30 |
Loss on drying | ≤0.2% |
Phosphorus content | 13.4±0.5% |
Nitrogen content | 6±0.5% |
HPLC Purity | ≥99% |
New type of halogen-free flame retardants, used in encapsulation Circuit board base material , resin etc. | |
Used for halogen-free flame retardant epoxy resin, products can be colorless and transparent.
Used in high-end PC, PC / ABS, PA, pet, PBT and PPO products.
Used for flame retardant of EMC epoxy encapsulants, epoxy composites, led, powder coatings,
potting materials, electronic and automotive parts.
